| 发明名称 |
REMOVAL OF SELECTED PORTIONS OF PROTECTIVE COATINGS FROM SUBSTRATES |
| 摘要 |
A method for selectively removing portions of a protective coating from a substrate, such as an electronic device, includes removing portions of the protective coating from the substrate. The removal process may include cutting the protective coating at specific locations, then removing desired portions of the protective coating from the substrate, or it may include ablating the portions of the protective coating that are to be removed. Coating and removal systems are also disclosed. |
| 申请公布号 |
US2016008923(A1) |
申请公布日期 |
2016.01.14 |
| 申请号 |
US201514861929 |
申请日期 |
2015.09.22 |
| 申请人 |
HzO, Inc. |
发明人 |
Astle David James;Child Tyler Christensen;Kasagani Vimal Kumar;Loose Cameron LaMar;Stevens Blake LeRoy;Sorenson Max Ernest |
| 分类号 |
B23K26/362;B23K26/0622;B23K26/082;B23K26/402 |
主分类号 |
B23K26/362 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for selectively removing a protective coating from a substrate, comprising:
applying a protective coating to a substrate; and selectively cutting at least a portion of the protective coating with a removal medium comprising a laser light. |
| 地址 |
Draper UT US |
