COMPOSITE FORMULATION AND COMPOSITE PRODUCT

摘要

A composite formulation (100) and composite product (102) are disclosed. The composite formulation includes a polymer matrix (101), particles (103) which are tin- containing particles (103) blended within the polymer matrix at a concentration, by weight, of at least 25% and copper-containing particles blended within the polymer matrix at a concentration, by weight, of at least 40%, and one or both of solder flux and density-lowering particles blended into the polymer matrix. The tin-containing particles and the copper- containing particles have one or more intermetallic phases from metal-metal diffusion of the tin-containing particles and the copper-containing particles being blended at a temperature within the intermetallic annealing temperature range for the tin-containing particles and the copper-containing particles.