| 发明名称 |
COMPOSITION, CURED ARTICLE, LAMINATE, METHOD FOR MANUFACTURING UNDERLYING FILM, METHOD FOR FORMING PATTERN, PATTERN AND METHOD FOR MANUFACTURING A RESIST FOR SEMICONDUCTOR PROCESS |
| 摘要 |
Provided is a composition capable of producing an underlying film which demonstrates a good adhesiveness between a substrate and a layer to be imprinted, showing a good in-plane uniformity of the thickness, and a small defect density. The composition includes a polymerizable compound, a first solvent, and a second solvent, the first solvent having a boiling point at 1 atm of 160° C. or higher, the second solvent having a boiling point at 1 atm of lower than 160° C., and the content of the polymerizable compound in the composition being less than 1% by mass. |
| 申请公布号 |
US2016009945(A1) |
申请公布日期 |
2016.01.14 |
| 申请号 |
US201514865949 |
申请日期 |
2015.09.25 |
| 申请人 |
FUJIFILM Corporation |
发明人 |
ENOMOTO Yuichiro;KITAGAWA Hirotaka;OOMATSU Tadashi;GOTO Yuichiro |
| 分类号 |
C09D133/14;H01L21/02;C09D133/08 |
主分类号 |
C09D133/14 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A composition comprising a polymerizable compound, a first solvent and a second solvent;
the first solvent having a boiling point at 1 atm of 160° C. or higher; the second solvent having a boiling point at 1 atm of lower than 160° C.; and the composition having a content of the polymerizable compound of less than 1% by mass. |
| 地址 |
Tokyo JP |
