| 摘要 |
PROBLEM TO BE SOLVED: To provide a terminal structure, a semiconductor device, an electronic device and a terminal formation method, which inhibit a solder material from diffusing to a lateral face of a pillar including a metallic material after solder bonding to improve bonding reliability.SOLUTION: A terminal structure comprises: a pillar 1 containing Cu which is a first metallic material; and a cover layer 2 which contains Ni that is a second metallic material where a solder material diffuses more slowly than in the first metallic material, and which covers a top face and a lateral face of the pillar 1. The cover layer 2 successfully prevents the solder material from diffusing to the lateral face of the pillar 1 after solder bonding. |
