| 发明名称 |
METHODS AND APPARATUSES FOR LASER PROCESSING MATERIALS |
| 摘要 |
Methods of laser processing a transparent material are disclosed. The method may include positioning the transparent material on a carrier and transmitting a laser beam through the transparent material, where the laser beam may be incident on a side of the transparent material opposite the carrier. The transparent material may be substantially transparent to the laser beam and the carrier may include a support base and a laser disruption element. The laser disruption element may disrupt the laser beam transmitted through the transparent material such that the laser beam may not have sufficient intensity below the laser disruption element to damage the support base. |
| 申请公布号 |
US2016008927(A1) |
申请公布日期 |
2016.01.14 |
| 申请号 |
US201514794181 |
申请日期 |
2015.07.08 |
| 申请人 |
Corning Incorporated |
发明人 |
Grundmueller Richard;Herrnberger Frank Fabian;Klein Michael;Spaeth Florian |
| 分类号 |
B23K26/70;B23K26/00;B23K26/57;C03B33/10;C03B33/08 |
主分类号 |
B23K26/70 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of laser processing a transparent material, the method comprising:
positioning the transparent material on a carrier; and transmitting a laser beam through the transparent material, the laser beam incident on a side of the transparent material opposite the carrier, wherein: the transparent material is substantially transparent to the laser beam; the carrier comprises a support base and a laser disruption element; and the laser disruption element optically disrupts the laser beam transmitted through the transparent material such that the laser beam does not have sufficient intensity below the laser disruption element to damage the support base. |
| 地址 |
Corning NY US |
