| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an alignment technique capable of positioning two objects at higher speed with higher accuracy. <P>SOLUTION: A bonding device 30 includes a head 33H for holding a chip CP and a substrate holding unit for holding a substrate WT and measurement means (imaging units 35a, 35b, etc.) for measuring a relative position error between both objects CP and WT. In a state that the chip CP is disposed at a predetermined bonding position (X, Y) in a plane, on which both objects CP and WT are disposed to face each other and which is parallel to the mounting plane of the substrate WT, the measurement means measures the relative position error between both objects CP, WT by imaging an alignment mark MC1 related to the chip CP and an alignment mark MC2 related to the substrate WT from at least one plane side (the upper side of the chip CP and/or the lower side of the substrate WT) out of two anti-opposite planes which are planes on the opposite side of each facing plane of both objects CP, WT. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
