| 摘要 |
<p>The invention relates to a device for processing material by means of laser radiation, comprising an emitting laser radiation source (S) emitting pulsed laser radiation (3) for interacting with the material (5), an optics system focusing the pulsed laser radiation (4) in the material (5) on an interaction center (7), wherein the laser pulses in the zones (8) surrounding the respectively associated interaction centers (7) interact with the material (5) such that material (5) is separated in the interaction zones (8), further comprising a scanning device (10) adjusting the location of the interaction center in the material (5), and a control device (17) controlling the scanning device (10) and the laser radiation source (S) such that a cut surface (9) is generated in the material (5) by the stringing together of interaction zones (8), the control unit (17) controlling the laser radiation source (S) and the scanning unit (10) such that adjacent interaction centers (7) are located at a spatial distance of a = 10 µm from one another.</p> |
