| 摘要 |
Some embodiments of the present invention relate to an electronic package. The electronic package includes a substrate, and a die attached to the substrate. The electronic package further includes an underfill positioned between the die and the substrate due to a capillary action. A support surrounds the die. The support provides the same beneficial fillet geometry on all die edges. Therefore, the support provides similar stress reduction on all the die edges. Other embodiments of the present invention relate to a method for manufacturing an electronic package. The method comprises the following steps: attaching a die to a substrate; and inserting an underfill between the die and the substrate by using a capillary action. The method further includes placing a support around the die so that the support surrounds the die. |
