发明名称 表面処理された金属粉の製造方法
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for producing a surface-treated copper powder and metal powder which can be suitably used for producing an electrode for a chip laminated ceramic capacitor and have excellent sintering delaying properties.SOLUTION: There is provided a method for producing a surface-treated metal powder which comprises: a step of mixing a metal powder which is produced by a wet method and has a D50 of 0.05μm to 1μm and a Dmax of 1μm or less with an alkaline aqueous solution, followed by separating to obtain an alkali-treated metal powder; a step of mixing the alkali-treated metal powder with a neutral aqueous solution of a coupling agent, followed by separating to obtain a coupling agent-treated metal powder; and a step of drying and pulverizing the coupling agent-treated metal powder.</p>
申请公布号 JP5843820(B2) 申请公布日期 2016.01.13
申请号 JP20130168385 申请日期 2013.08.13
申请人 JX日鉱日石金属株式会社 发明人 古澤 秀樹
分类号 B22F1/02;H01B1/00;H01B1/22;H01B5/00;H01B13/00;H01G4/232;H01G4/30;H05K1/09 主分类号 B22F1/02
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