| 摘要 |
<p>A thermosetting resin composition has good storage properties at room temperature and an unreacted epoxy resin etc. are less likely to exude therefrom during heat compression molding. The thermosetting resin composition contains an acrylic copolymer including an epoxy group-containing (meth)acrylate unit, an epoxy resin, and a curing agent for an epoxy resin. In this thermosetting resin composition, epoxy groups in at least the acrylic copolymer are partially cross-linked with an amine compound and a thiol compound having 2 to 4 thiol groups per molecule, and the curing agent for an epoxy resin is an organic acid dihydrazide.</p> |
