| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a heat spreader ensuring sufficient thermal diffusion effect. <P>SOLUTION: The heat spreader 6 comprises: a metal layer 6A; and a diamond piece 6B provided on at least one surface of the metal layer 6A and exposed to the surface. The surface (bottom face) of the heat spreader 6 where the diamond piece 6B is exposed is connected thermally to the surface of a semiconductor chip. Since diamond has extremely high heat conductivity, heat conductivity increases extremely in the in-plane direction on the surface of the heat spreader 6 connected with the semiconductor chip, and thereby sufficient thermal diffusion effect is obtained. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
