发明名称 |
Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste and Ag paste |
摘要 |
Providing an Ag ball having a low alpha dose and a high sphericity regardless of impurity elements having an amount equal to or more than a predetermined value except for Ag. In order to suppress a soft error and reduce an connection fault, a content of U is equal to or less than 5 ppb, a content of Th is equal to or less than 5 ppb, a purity is equal to or more than 99.9% but equal to or less than 99.9995%, an alpha dose is equal to or less than 0.0200 cph/cm 2 , a content of either Pb or Bi or a total content of both Pb and Bi is equal to or more than 1 ppm, and a sphericity is equal to or more than 0.90. |
申请公布号 |
EP2905349(A3) |
申请公布日期 |
2016.01.13 |
申请号 |
EP20150153374 |
申请日期 |
2015.01.30 |
申请人 |
SENJU METAL INDUSTRY CO., LTD. |
发明人 |
KAWASAKI, HIROYOSHI;MATSUI, KAZUHIKO;KOIKEDA, YUICHI;SASAKI, MASARU;YAMASAKI, HIROYUKI;ROPPONGI, TAKAHIRO;SOMA, DAISUKE;SATO, ISAMU;AKAGAWA, TAKASHI |
分类号 |
C22C5/06;B23K35/00 |
主分类号 |
C22C5/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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