发明名称 Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste and Ag paste
摘要 Providing an Ag ball having a low alpha dose and a high sphericity regardless of impurity elements having an amount equal to or more than a predetermined value except for Ag. In order to suppress a soft error and reduce an connection fault, a content of U is equal to or less than 5 ppb, a content of Th is equal to or less than 5 ppb, a purity is equal to or more than 99.9% but equal to or less than 99.9995%, an alpha dose is equal to or less than 0.0200 cph/cm 2 , a content of either Pb or Bi or a total content of both Pb and Bi is equal to or more than 1 ppm, and a sphericity is equal to or more than 0.90.
申请公布号 EP2905349(A3) 申请公布日期 2016.01.13
申请号 EP20150153374 申请日期 2015.01.30
申请人 SENJU METAL INDUSTRY CO., LTD. 发明人 KAWASAKI, HIROYOSHI;MATSUI, KAZUHIKO;KOIKEDA, YUICHI;SASAKI, MASARU;YAMASAKI, HIROYUKI;ROPPONGI, TAKAHIRO;SOMA, DAISUKE;SATO, ISAMU;AKAGAWA, TAKASHI
分类号 C22C5/06;B23K35/00 主分类号 C22C5/06
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