发明名称 電子機器収容装置
摘要 <p>PROBLEM TO BE SOLVED: To provide an electronic apparatus housing device capable of efficiently cooling an electronic apparatus unit arranged in a housing by air with a simple structure.SOLUTION: In the electronic apparatus housing device, a plurality of electronic apparatus units 1A, 1B, 1C each having a heat dissipation part 1a are housed in a housing 2 and arranged in the vertical direction, and air introduced from an external air introducing port 2a provided in the lower portion of the housing is discharged from an air discharge port 2b provided in the upper portion of the housing. The electronic apparatus housing device includes at least one air guide member 3 which guides the air such that the air having passed through the heat dissipation part of the lower electronic apparatus unit, among the electronic apparatus units adjacent to each other in the vertical direction, is guided to the air discharge port without passing through the heat dissipation part of the upper electronic apparatus unit, and the external air introduced from the external air introducing port is guided to the heat dissipation part of the upper electronic apparatus unit.</p>
申请公布号 JP5843752(B2) 申请公布日期 2016.01.13
申请号 JP20120286782 申请日期 2012.12.28
申请人 三菱電機株式会社 发明人 狩田 利一
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
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