发明名称 |
METHOD AND DEVICE FOR PROVIDING THROUGH-OPENINGS IN A SUBSTRATE AND A SUBSTRATE PRODUCED IN SAID MANNER |
摘要 |
A method and device can create, with a laser beam, plural recesses in a substrate useful as an interposer, and a substrate produced thereby. A laser beam may be directed to the surface of a substrate. The duration of the laser beam effect is extremely short such that the substrate is only modified concentrically about the laser beam axis without reaching a substrate material recess. The laser beam is initially diverted by a transmission medium having a higher intensity-dependent refractive index than air, and subsequently reaching the substrate. Non-constant pulsed laser intensity increases to a maximum over the temporal course of the single pulse, then reduces; the refractive index also changes. The focus point of the laser beam moves between the outer surfaces of the substrate along the beam axis such that it reaches the desired modification along the beam axis without correcting the laser processing head in the z-axis. |
申请公布号 |
EP2964417(A2) |
申请公布日期 |
2016.01.13 |
申请号 |
EP20140726069 |
申请日期 |
2014.04.03 |
申请人 |
LPKF LASER & ELECTRONICS AG |
发明人 |
KRÜGER, ROBIN, ALEXANDER;AMBROSIUS, NORBERT;OSTHOLT, ROMAN |
分类号 |
B23K26/00;B23K26/06;H01L21/30;H01S3/00 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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