| 摘要 |
Disclosed is a wafer marking method for marking a wafer, which has processing tape attached thereto, by using a laser. The disclosed laser marking method comprises the following steps of: penetrating a laser beam of a wavelength of 532 nm through the processing tape attached to one side of the wafer; and performing a marking work on the one side of the wafer by moving the laser beam of a wavelength of 532 nm at a predetermined velocity wherein the laser beam of a wavelength of 532 nm has a frequency of 8 kHz to 40 kHz, and output power of 0.8 W to 2 W. |
