| 摘要 |
1,057,003. Semi-conductor devices. SIEMENS SCHUCKERTWERKE A.G. May 29, 1964 [May 29, 1963], No. 22462/64. Heading H1K. In soldering terminal plates 5 and 11 to a semi-conductor element or rectifier stack 9, the element or stack is located by pins 2, 3, 4 fitted in holes in the plates. The pins are part of a withdrawable jig 1. The holes in the plates have the same configuration as but of larger diameter than the pins, and the process of assembly involves the fitting of the plates on the pins and of the element or stack together with solder layers 8, 10 between the plates and the pins, and subsequently heating to melt the solder. An etching or other treatment may be performed subsequently and the complete assembly may then be fitted in a suitable housing. In an embodiment the element 9 is a silicon PN diode with nickel or gold-on-nickel electrode layers secured by lead-tin solder to the plates. The latter are of copper or iron and may serve both as terminals and as cooling fins. The single diode shown may be replaced by a plurality of diodes connected as a centre-tapped or bridge rectifier. Figs. 2 and 3 (not shown) depict respectively a three-pin and a four-pin element locating arrangement; the latter is appropriate if the element is rectangular and the former for other shapes of element, e.g. non-rectangular polygons or circles. |
