发明名称 回路基板検査装置および回路基板検査方法
摘要 <p><P>PROBLEM TO BE SOLVED: To improve efficiency of insulation tests between each conductor pattern of a circuit board. <P>SOLUTION: In testing insulation between each of 16 conductor patterns, a number of connection processing are carried out in a predetermined order. The connection processing comprises; an A-type connection processing in which conductor patterns numbered 1 to 3 and 6 to 10 are connected to low electric potential as a group 1, and other conductor patterns are connected to high electric potential as a group 2; a B-type connection processing in which conductor patterns numbered 3 to 6 and 9 to 12 are connected to the low electric potential as a first group, and other conductor patterns are connected to the high electric potential as a second group; C-type connection processing in which conductor patterns numbered 1 to 4, 10, 11, 15, and 16 are connected to the low electric potential as a first group and other conductor patterns are connected to the high electric potential as a second group; and a D-type connection processing in which conductor patterns numbered 2 to 7, 14, and 15 are connected to the low electric potential as a first group and other conductors are connected to the high electric potential as a group 2. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5844096(B2) 申请公布日期 2016.01.13
申请号 JP20110194036 申请日期 2011.09.06
申请人 日置電機株式会社 发明人 清水 隆弘;塩入 章弘;池田 大桂;村山 林太郎
分类号 G01R31/02;H05K3/00 主分类号 G01R31/02
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