| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve the cleanliness of a substrate. <P>SOLUTION: A substrate processing apparatus 1 includes: a spin chuck 3 for holding a substrate W; and a cup 6 disposed at the outer side relative to an outer periphery of the substrate W held by the spin chuck 3. The cup 6 forms airflow flowing along an upper surface of the substrate W by discharging the gas onto the substrate W from a gas discharge port. The airflow protects the upper surface of the substrate W from particles and mist. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
