| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device, the method sufficiently suppressing chip flying caused in a dicing process and both chip break and pickup error caused in a pickup process; and to provide the semiconductor device. <P>SOLUTION: The method of manufacturing the semiconductor device includes: a preparation step of preparing a laminate 100 for which a semiconductor wafer 3, an adhesion film 1 and a dicing tape 2 are laminated in this order, a radiation curing type glue layer 10 is provided on the adhesion film side, and the 90°peeling strength of the adhesion film and the dicing tape is 0.2-0.6 N/25 mm; a dicing step of dicing it into semiconductor chips and cutting the adhesion film; a radiation irradiation step of irradiating the laminate with radiation from the dicing tape side so that the 90°peeling strength between the adhesion film and the dicing tape becomes 0.4 N/25 mm or less; a pickup step of picking up the semiconductor chip and obtaining the semiconductor chip with the adhesion film; and an adhesion step of bonding the semiconductor chip to a support member for loading the semiconductor chip. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
