| 摘要 |
The present invention provides a curable composition, comprising: (A) at least one polycarbosilane A represented by the following formula (1): [R1R2R3SiX1/2]M[R4R5SiX2/2]D[R6SiX3/2]T[SiX4/2]Q  (1), (B) at least one organopolysiloxane B represented by the following formula (2): [R7R8R9SiO1/2]M′[R10R11SiO2/2]D′[R12SiO3/2]T′[SiO4/2]Q′,  (2), and (C) at least a catalyst, as well as a cured product obtainable by heating such composition, and the use of the composition as semiconductor encapsulating material and/or electronic elements packaging material. |
