发明名称 |
PACKAGE INTEGRITY MONITOR WITH SACRIFICIAL BUMPS |
摘要 |
<p>An apparatus with package integrity monitoring capability, includes: a package having a die connected to an interposer through a plurality of bumps, wherein at least some of the bumps comprise dummy bumps; a package integrity monitor having a transmitter to transmit a test signal and a receiver to receive the test signal; and a first scan chain comprising a plurality of alternating interconnects in the die and in the interposer connecting some of the dummy bumps in series, wherein the first scan chain has a first end coupled to the transmitter of the package integrity monitor and a second end coupled to the receiver of the package integrity monitor.</p> |
申请公布号 |
EP2965348(A1) |
申请公布日期 |
2016.01.13 |
申请号 |
EP20140713702 |
申请日期 |
2014.03.06 |
申请人 |
XILINX, INC. |
发明人 |
LOWNEY, DONNACHA;DE LA TORRE, MARITES |
分类号 |
H01L21/66;G01R31/3185;G01R31/3187;H01L25/065 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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