发明名称 WAFER FOR IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME
摘要 The present invention suggests a wafer for an image sensor and a method of manufacturing the same. The wafer for an image sensor includes a substrate; a gettering layer which is formed by injecting hydrogen ions into the substrate, and getters metal impurities; and an epitaxial layer formed on a surface of the substrate. The gettering layer is formed by injecting hydrogen ions of which a dosed amount is 1×10^(15) to 1×10^(16) ions/cm^2.
申请公布号 KR20160004900(A) 申请公布日期 2016.01.13
申请号 KR20150011073 申请日期 2015.01.23
申请人 IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) 发明人 PARK, JEA GUN;KIM, IL HWAN
分类号 H01L27/146 主分类号 H01L27/146
代理机构 代理人
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