| 发明名称 |
SYSTEM FOR MANUFACTURING A SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A system for manufacturing a semiconductor package comprises: a laser marking unit for marking by irradiating a laser on a strip; and a laser cutting unit for cutting an individual semiconductor package by irradiating the laser on the strip. |
| 申请公布号 |
KR20160004601(A) |
申请公布日期 |
2016.01.13 |
| 申请号 |
KR20140083116 |
申请日期 |
2014.07.03 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SONG, YOON SEOK;KO, JUN YOUNG;LEE, HAE GU |
| 分类号 |
H01L21/268;H01L21/301;H01L21/324;H01L21/683;H01L23/544 |
主分类号 |
H01L21/268 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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