发明名称 |
POLISHING COMPOSITION, POLISHING METHOD USING SAME, AND METHOD FOR PRODUCING SUBSTRATE |
摘要 |
A polishing composition of the present invention contains a water-soluble polymer and abrasive grains. The water-soluble polymer is an anionic compound having an acid dissociation constant pKa of 3 or less. Specific examples of such a compound include polyvinylsulfonic acid, polystyrenesulfonic acid, polyallylsulfonic acid, polyethyl acrylate sulfonic acid, polybutyl acrylate sulfonic acid, poly(2-acrylamide-2-methylpropanesulfonic acid), and polyisoprenesulfonic acid. The abrasive grains exhibit a negative zeta potential at a pH of 3.5 or less. Specific examples of such abrasive grains include colloidal silica. |
申请公布号 |
EP2851937(A4) |
申请公布日期 |
2016.01.13 |
申请号 |
EP20130790468 |
申请日期 |
2013.04.04 |
申请人 |
FUJIMI INCORPORATED |
发明人 |
YAMATO, YASUYUKI;AKATSUKA, TOMOHIKO |
分类号 |
H01L21/3105;B24B37/04;C09G1/02;C09K3/14;H01L21/762 |
主分类号 |
H01L21/3105 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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