发明名称 半導体素子
摘要 A semiconductor device includes a semiconductor layer laminate in which a plurality of semiconductor layers are laminated, the semiconductor layer laminate including a light receiving layer, the light receiving layer being grown by a metal-organic vapor phase epitaxy method, the light receiving layer having a cutoff wavelength of more than or equal to 3 μm and less than or equal to 8 μm, the semiconductor device having a dark current density of less than or equal to 1×10−1 A/cm2 when a reverse bias voltage of 60 mV is applied at a temperature of −140° C. Thereby, a semiconductor device which can receive light in a mid-infrared range and has a low dark current is provided.
申请公布号 JP5842894(B2) 申请公布日期 2016.01.13
申请号 JP20130222164 申请日期 2013.10.25
申请人 住友電気工業株式会社 发明人 京野 孝史;秋田 勝史;柴田 馨;西塚 幸司;藤井 慧
分类号 H01L31/10;H01L21/205 主分类号 H01L31/10
代理机构 代理人
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