发明名称 ケイ素含有硬化性組成物及びその硬化物
摘要 A silicon-containing curing composition comprising a specific amount of a silicon-containing polymer having an Mw of 300 to 100,000 obtained by hydrolysis and condensation of an organosilane mixture containing specific amounts of organosiloxanes of formulae (1-1) through (1-5); a specific amount of a prepolymer containing at least two Si-H groups per molecule obtained by hydrosilylation between a cyclic siloxane compound of formula (2) and a compound of formula (3-1), (3-2), or (3-3); a specific amount of a linear siloxane compound containing more than one carbon-carbon double bond reactive with Si-H or Si-CH 3 per molecule; specific amounts of an organic peroxide and a metal catalyst; and a specific amount of a filler. The details for the formulae (1-1) to (1-5), (2), (3-1) to (3-3) are as described in the specification.
申请公布号 JP5844371(B2) 申请公布日期 2016.01.13
申请号 JP20130527920 申请日期 2012.06.05
申请人 株式会社ADEKA 发明人 斎藤 雅子;知場 亮太;金沢 拓哉;平塚 一郎;神林 孝明
分类号 C08L83/07;C08K3/00;C08K5/04;C08K5/14;C08L83/05 主分类号 C08L83/07
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