发明名称 HEAT MODULE
摘要 PROBLEM TO BE SOLVED: To provide a heat module that has a high cooling characteristic while being thinned by thinning a heat pipe as much as possible.SOLUTION: A heat module 100 comprises: a fan 1; and a heat pipe 5 with a flat cross section whose one end is thermally contacted with a heat source and whose other end is thermally contacted with the fan, and that includes a recessed part 52. The fan has an impeller, a motor, and a housing 3. The housing has a heat sink 34, a side wall part 33, and a fan contact part 37 thermally contacted with the heat pipe. A heat receiving part 7 interposed between the heat source 6 and the heat pipe has a heat source contact part 71 thermally contacted with the heat pipe. At least a part of a section from a position thermally contacted with the fan contact part of the heat pipe to a position thermally contacted with the heat source contact part, a difference between a maximum axial height of the heat pipe and an axial height of the heat pipe at a part where the recessed part is located is smaller than a thickness of the recessed part.
申请公布号 JP2016004839(A) 申请公布日期 2016.01.12
申请号 JP20140122755 申请日期 2014.06.13
申请人 NIPPON DENSAN CORP 发明人 TAMAOKA TAKETO;FUKUSHIMA KAZUHIKO;HATANAKA KOJI
分类号 H05K7/20;F28D15/02;G06F1/20;H01L23/427 主分类号 H05K7/20
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