| 摘要 |
PROBLEM TO BE SOLVED: To provide a high density film for IC package not having an interposer.SOLUTION: In the process for manufacturing a high density film for IC package, a rewiring layer is manufactured according to an IC design rule, together with a plurality of bottom pads formed on the bottom, and a plurality of first upper pads formed above. Density of the plurality of bottom pads is higher than that of the plurality of first upper pads. An upper rewiring layer is manufactured according to a PCB design rule by using the plurality of first upper pads as origins, together with a plurality of second upper pads formed above. Density of the plurality of first upper pads is higher than that of the plurality of second upper pads. |
