发明名称 Electronic circuit apparatus
摘要 For an electronic circuit apparatus including a shunt resistor, provided is a measure for improving the heat dissipation performance of the shunt resistor. The shunt resistor includes electrodes at both ends. One of the two electrodes is connected to a surface-mounting pattern on which the shunt resistor is surface-mounted. A current-generating-side pattern and a current-receiving-side pattern are arranged separately from the surface-mounting pattern. The current-generating-side pattern and the surface-mounting pattern are connected together via a connection member which creates a space between itself and a substrate.
申请公布号 US9237653(B2) 申请公布日期 2016.01.12
申请号 US201314425558 申请日期 2013.08.30
申请人 DAIKIN INDUSTRIES, LTD. 发明人 Kondou Rei;Tanaka Mitsuhiro;Koyama Yoshitsugu
分类号 H01C7/00;H05K1/18;G01R1/20;H01C13/00;H02P6/00;H05K1/02;H05K1/11;H01C1/084 主分类号 H01C7/00
代理机构 Birch, Stewart, Kolasch & Birch, LLP 代理人 Birch, Stewart, Kolasch & Birch, LLP
主权项 1. An electronic circuit apparatus in which a shunt resistor, including a resistance element between electrodes, is surface-mounted to a substrate and in which electric current flowing from a current-generating-side pattern into a current-receiving-side pattern is detected by the shunt resistor that is arranged on a path of the electric current, wherein at least one of the electrodes of the shunt resistor is connected to a surface-mounting pattern on which the shunt resistor is surface-mounted, and the surface-mounting pattern is connected to the current-generating-side pattern or the current-receiving-side pattern via a connection member which creates a space between the connection member itself and the substrate.
地址 Osaka-Shi JP