发明名称 |
Electronic circuit apparatus |
摘要 |
For an electronic circuit apparatus including a shunt resistor, provided is a measure for improving the heat dissipation performance of the shunt resistor. The shunt resistor includes electrodes at both ends. One of the two electrodes is connected to a surface-mounting pattern on which the shunt resistor is surface-mounted. A current-generating-side pattern and a current-receiving-side pattern are arranged separately from the surface-mounting pattern. The current-generating-side pattern and the surface-mounting pattern are connected together via a connection member which creates a space between itself and a substrate. |
申请公布号 |
US9237653(B2) |
申请公布日期 |
2016.01.12 |
申请号 |
US201314425558 |
申请日期 |
2013.08.30 |
申请人 |
DAIKIN INDUSTRIES, LTD. |
发明人 |
Kondou Rei;Tanaka Mitsuhiro;Koyama Yoshitsugu |
分类号 |
H01C7/00;H05K1/18;G01R1/20;H01C13/00;H02P6/00;H05K1/02;H05K1/11;H01C1/084 |
主分类号 |
H01C7/00 |
代理机构 |
Birch, Stewart, Kolasch & Birch, LLP |
代理人 |
Birch, Stewart, Kolasch & Birch, LLP |
主权项 |
1. An electronic circuit apparatus in which a shunt resistor, including a resistance element between electrodes, is surface-mounted to a substrate and in which electric current flowing from a current-generating-side pattern into a current-receiving-side pattern is detected by the shunt resistor that is arranged on a path of the electric current, wherein
at least one of the electrodes of the shunt resistor is connected to a surface-mounting pattern on which the shunt resistor is surface-mounted, and the surface-mounting pattern is connected to the current-generating-side pattern or the current-receiving-side pattern via a connection member which creates a space between the connection member itself and the substrate. |
地址 |
Osaka-Shi JP |