Curvature adjustment structure of curved liquid crystal display device

摘要

The present invention provides a curvature adjustment structure of a curved liquid crystal display device, which includes: a backplane (1) and at least one bracing assembly (3) fixedly mounted to the backplane (1). Each bracing assembly (3) includes a first bracing member (31) in contact engagement with the backplane (1), a second bracing member (33) opposite to the first bracing member (31) and distant from the backplane (1), and a cooling chip array (35) arranged between the first and second bracing members (31, 33). The cooling chip array (35) includes a plurality of cooling chips (2). Each of the cooling chips (2) includes a heat absorption surface (22) and an opposite heat dissipation surface (24). The heat absorption surface (22) and the heat dissipation surface (24) of each of the cooling chips (2) are respectively in engagement with the first and second bracing members (31, 33), whereby through energizing the cooling chip array (35), the first and second bracing members (31, 33) are respectively caused to undergo thermal expansion and contraction to achieve curving and deformation of the bracing assembly (3) so as to forcibly change the curvature of the backplane (1).

主权项

1. A curvature adjustment structure of a curved liquid crystal display device, comprising a backplane and at least one bracing assembly fixedly mounted to the backplane, each bracing assembly comprising a first bracing member in contact engagement with the backplane, a second bracing member opposite to the first bracing member and distant from the backplane, and a cooling chip array arranged between the first and second bracing members, the cooling chip array comprising a plurality of cooling chips, each of the cooling chips comprising a heat absorption surface and a heat dissipation surface opposite to the heat absorption surface, the heat absorption surface and the heat dissipation surface of each of the cooling chips being respectively in engagement with the first bracing member and the second bracing member, whereby through energizing the cooling chip array, the heat absorption surfaces and the heat dissipation surfaces respectively affect temperatures of the first bracing member and the second bracing member to cause thermal expansion and contraction of the first and second bracing members so as to achieve curving and deformation of the bracing assembly and make the bracing assembly forcibly change curvature of the backplane.