发明名称 Memory cells and methods of forming memory cells
摘要 Some embodiments include methods of forming memory cells. Programmable material may be formed directly adjacent another material. A dopant implant may be utilized to improve adherence of the programmable material to the other material by inducing bonding of the programmable material to the other material, and/or by scattering the programmable material and the other material across an interface between them. The memory cells may include first electrode material, first ovonic material, second electrode material, second ovonic material and third electrode material. The various electrode materials and ovonic materials may join to one another at boundary bands having ovonic materials embedded in electrode materials and vice versa; and having damage-producing implant species embedded therein. Some embodiments include ovonic material joining dielectric material along a boundary band, with the boundary band having ovonic material embedded in dielectric material and vice versa.
申请公布号 US9236566(B2) 申请公布日期 2016.01.12
申请号 US201514799411 申请日期 2015.07.14
申请人 Micron Technology, Inc. 发明人 Bresolin Camillo;Soncini Valter;Erbetta Davide
分类号 H01L21/8234;H01L45/00 主分类号 H01L21/8234
代理机构 Wells St. John P.S. 代理人 Wells St. John P.S.
主权项 1. A memory cell, comprising: a first ovonic material over a first electrode material, the first ovonic material joining the first electrode material at a first boundary band; a second electrode material over the first ovonic material, the first ovonic material joining the second electrode material at a second boundary band; a second ovonic material over the second electrode material, the second ovonic material joining the second electrode material at a third boundary band; a third electrode material over the second ovonic material, the second ovonic material joining the third electrode material at a fourth boundary band; one of the first and second ovonic materials being an ovonic memory material, and the other of the first and second ovonic materials being an ovonic threshold switch material; and wherein the first, second, third and fourth boundary bands comprise ovonic materials embedded in electrode materials and vice versa, and comprise damage-producing implant species embedded in the electrode materials and the ovonic materials.
地址 Boise ID US