发明名称 |
Integrated circuit package |
摘要 |
An integrated circuit package comprising a substrate and at least one semiconductor die is described. A connection unit may provide electrical connections between the substrate and the semiconductor die. The connection unit may comprise a stack of conduction layers and isolation layers stacked atop each other. The stack may include a microstrip line or a coplanar waveguide. The microstrip line or the coplanar waveguide may be part of a balun, a power divider, or a directional coupler. |
申请公布号 |
US9236358(B2) |
申请公布日期 |
2016.01.12 |
申请号 |
US201114240765 |
申请日期 |
2011.08.31 |
申请人 |
Freescale Semiconductor, Inc. |
发明人 |
Reuter Ralf;Trotta Saverio |
分类号 |
H01L23/66;H01P5/10;H01P3/00;H01L23/00;H01L23/498 |
主分类号 |
H01L23/66 |
代理机构 |
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代理人 |
|
主权项 |
1. An integrated circuit package comprising:
a substrate, one or more semiconductor dies, and a connection unit configured to provide electrical connections between said substrate and said one or more semiconductor dies, wherein, said connection unit comprises a stack comprising
two or more conduction layers, including a first conduction layer and a second conduction layer and of one or more isolation layers stacked atop each other in an alternating manner,the first conduction layer comprising a microstrip conductive line, andthe second conduction layer comprising a ground plane and one or more coplanar conductive lines, wherein said microstrip conductive line and said ground plane form a microstrip line and said one or more coplanar conductive lines and said ground plane form a coplanar waveguide. |
地址 |
Austin TX US |