Modular audio systems and related assemblies and methods

摘要

Modular audio systems comprise two speaker assemblies and a wiring system. Each speaker assembly may comprise a speaker and an audio jack integral to each speaker assembly. The wiring system comprises a first wiring assembly comprising two audio jacks configured to connect to the audio jacks of the two speaker assemblies and two wires connected to the two audio jacks at first ends of the two wires. Headphone assemblies may comprise two speaker assemblies and a headband configured for removable attachment to the speaker assemblies. Each speaker assembly may comprise an attachment structure configured for attachment to another device or structure, wherein the attachment structure of each speaker assembly of the two speaker assemblies comprises a frustoconical surface and two first attachment features comprising elongated features on the frustoconical surface.

主权项

1. A modular audio system, comprising:
two speaker assemblies, each speaker assembly of the two speaker assemblies comprising:
a speaker;an attachment structure comprising an at least substantially frustoconical surface and an elongated attachment feature extending along at least a portion of the at least substantially frustoconical surface; andan audio jack integral to each speaker assembly in electrical communication with the speaker; a wiring system, comprising:
a first wiring assembly comprising two audio jacks configured to detachably connect to the audio jacks of the two speaker assemblies and two wires connected to the two audio jacks at first ends of the two wires; and a headband comprising a band configured for placement on a head of a user and two attachment portions at opposing ends of the band configured for removable attachment to the attachment structures of the two speaker assemblies, each attachment portion of the two attachment portions comprising:a mating frustoconical surface complementary to the frustoconical surface of the attachment structure of a speaker assembly; andat least a second attachment feature on the mating frustoconical surface configured to engage with the at least a first attachment feature on the frustoconical surface of the attachment structure of a speaker assembly.