| 摘要 |
PROBLEM TO BE SOLVED: To reduce a resistance difference in power supply paths from a power supply pad to a plurality of data output buffers.SOLUTION: A semiconductor device comprises: pull-down units N2, N3 which are respectively connected to data input/output pads DQ2, DQ3 arranged adjacent to each other and which are arranged adjacent to each other; and power supply paths for connecting a power supply pad VSSQ with the pull down units N2, N3. The first power supply path includes: power supply wiring SL4 which extends in the same wiring layer M4 with the power supply pad VSSQ; power supply wiring SL3 which extends in a third wiring layer M3; and a contact plug THS for connecting the power supply wiring SL4 and the power supply wiring SL3. The contact plug THS is arranged between the pull down units N2, N3. According to the present embodiment, since a resistance difference in power supply paths from the power supply pad to the plurality of data output buffers is reduced, a difference in characteristics among a plurality of data output buffers can be suppressed. |
