| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal foil-clad board capable of dissipating heat, generated from a heating element to be mounted, efficiently and capable of manufacturing a circuit board that can be mounted on other structure, without restricting the whole shape, and to provide a circuit board manufactured using the metal foil-clad board, and a heating element mounting board where a heating element is mounted on the circuit board.SOLUTION: A metal foil-clad board 10A is used for forming a circuit board on which a heating element is mounted, and includes a metal foil 4A, a resin layer 5, a heat dissipation metal plate 7, and an insulation 6. The metal foil 4A, the resin layer 5, and the insulation 6 superposed each other have bends 81-84 bending to the metal foil 4A side or the insulation 6 side. The resin layer 5 is composed of a hardened material or a solidified material of a resin composition for resin layer formation containing a resin material, and the insulation 6 is composed of a hardened material of the resin composition for insulation formation containing a thermosetting resin. |
