| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, in the case where an IC which is large-sized and of which the calorific value is high like a large-sized sensor is packaged on a rigid substrate as illustrated in Fig. 1, an operational defect may occur by cracking a soldered portion in a terminal of a package because of a difference between a coefficient of thermal expansion of the package of the IC and a coefficient of thermal expansion of the rigid substrate, therefore, in order to reduce a stress to be applied to the package terminal portion/soldered portion, the IC which is large-sized and of which the calorific value is high like the large-sized sensor is not packaged on the rigid substrate but packaged on a flexible substrate as illustrated in Fig. 3 and a technology may be adopted for absorbing the stress applied to the soldered portion with flexibility of the flexible substrate but a degree of freedom in component arrangement or wiring may be significantly impaired.SOLUTION: A pattern for packaging the terminal portion of the IC is disposed in a flexible substrate part of the rigid flexible substrate and a rigid substrate part is disposed in a lower part of the IC, such that the IC is packaged so as to be spread over the rigid substrate part. |
