| 摘要 |
PROBLEM TO BE SOLVED: To suppress oxidation within an entire surface to be processed of a substrate that has been processed by a processing module, when conveying the substrate by a vacuum conveying chamber that is provided between a vacuum processing chamber forming the processing module and a load lock chamber.SOLUTION: A vacuum processing device includes: the processing module; the load lock chamber for switching an atmosphere between a vacuum atmosphere and a normal pressure atmosphere; the vacuum conveying chamber which is provided between the vacuum processing chamber and the load lock chamber via a partition valve and in which the substrate is conveyed between the vacuum processing chamber and the load lock chamber; an inert gas supply section provided in the vacuum conveying chamber for supplying an inert gas to a side of the surface to be processed in the processed substrate on which the processing has been performed, over a full width of a conveying area along the conveying area of the substrate; and an exhaust port that is provided in the vacuum conveying chamber. Thus, moisture within the vacuum conveying chamber is prevented from being deposited over the entire surface to be processed of the substrate, and the oxidation can be prevented within the entire surface to be processed. |
