| 摘要 |
The present invention relates to a semiconductor package and a manufacturing method thereof. The semiconductor package comprises: a first package which has a first package substrate on which a lower semiconductor chip is mounted; and a second package which is stacked on the first package, and has a second package substrate on which upper semiconductor chips are mounted. The second package substrate includes a chip area which is overlapped with the lower semiconductor chip, and provides an area where the upper semiconductor chips are mounted; and a connection area which occupies an outer part of the chip area. The chip area includes a first face which has a first depression portion facing the lower semiconductor chip, and a second face having a first protrusion portion, which is an opposite face to the first face. The upper semiconductor chips are separated on both edges of the second face, and are mounted to partially protrude toward the connection area over the chip area. |
