| 发明名称 | Flexible printed circuit integrated with conductive layer | ||
| 摘要 | A conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film; and (C) a wiring-pattern-equipped film the electromagnetic-shielding conductive layer (A), the insulator film (B), and the wiring-pattern-equipped film (C) being laminated in this order, the insulator film (B) containing at least (a) a binder polymer and (b) spherical organic beads. | ||
| 申请公布号 | US9237645(B2) | 申请公布日期 | 2016.01.12 |
| 申请号 | US201214113729 | 申请日期 | 2012.04.26 |
| 申请人 | KANEKA CORPORATION | 发明人 | Kido Masayoshi;Sekito Yoshihide |
| 分类号 | H05K9/00;H05K1/02;H05K1/03 | 主分类号 | H05K9/00 |
| 代理机构 | Kagan Binder, PLLC | 代理人 | Kagan Binder, PLLC |
| 主权项 | 1. A conductive-layer-integrated flexible printed circuit board comprising: (A) an electromagnetic-shielding conductive layer; (B) an insulator film; and (C) a wiring-pattern-equipped film, the electromagnetic-shielding conductive layer (A), the insulator film (B), and the wiring-pattern-equipped film (C) being laminated in this order, the insulator film (B) containing at least (a) a binder polymer and (b) spherical organic beads. | ||
| 地址 | Osaka JP | ||