发明名称 Transistor having replacement gate and epitaxially grown replacement channel region
摘要 The disclosure provides a method of forming a transistor. In this method, a dummy gate structure is formed over a semiconductor substrate. Source/drain regions are then formed in the semiconductor substrate such that a channel region, which is arranged under the dummy gate structure in the semiconductor substrate, separates the source/drains from one another. After the source/drain regions have been formed, the dummy gate structure is removed. After the dummy gate structure has been removed, a surface region of the channel region is removed to form a channel region recess. A replacement channel region is then epitaxially grown in the channel region recess.
申请公布号 US9236445(B2) 申请公布日期 2016.01.12
申请号 US201414156505 申请日期 2014.01.16
申请人 Taiwan Semiconductor Manufacturing Co., Ltd. 发明人 Liu Chia-Wen;Yu Tsung-Hsing;Wu Wei-Hao;Ieong Meikei;Goto Ken-Ichi;Wu Zhiqiang
分类号 H01L29/78;H01L29/66;H01L29/36 主分类号 H01L29/78
代理机构 Eschweiler & Associates, LLC 代理人 Eschweiler & Associates, LLC
主权项 1. A method, comprising: providing a dummy gate structure over a semiconductor substrate; forming source/drain regions in the semiconductor substrate such that a channel region, which is arranged under the dummy gate structure in the semiconductor substrate, separates the source/drains from one another; after the source/drain regions have been formed, removing the dummy gate structure; after the dummy gate structure has been removed, removing a surface region of the channel region to form a channel region recess; and epitaxially growing a replacement channel region in the channel region recess.
地址 Hsin-Chu TW