发明名称 Mounting substrate and light emitting device
摘要 External connection conductors are arranged on a back surface of a base material, and wiring conductors are arranged on a front surface. An insulating layer is provided on surfaces of the wiring conductors. Component mounting conductors are provided on a surface of the insulating layer. The component mounting conductor and the wiring conductor are electrically coupled to each other, and the component mounting conductor and the wiring conductor are electrically coupled to each other. The wiring conductor and the external connection conductor are electrically coupled by a conductor film on an inner wall surface of a hole provided between forming areas of the component mounting conductors. The wiring conductor and the external connection conductor are electrically coupled by a conductor film on an inner wall surface of a hole provided between the forming areas of the component mounting conductors.
申请公布号 US9236357(B2) 申请公布日期 2016.01.12
申请号 US201414556404 申请日期 2014.12.01
申请人 Murata Manufacturing Co., Ltd. 发明人 Fukumitsu Masakazu;Yoshii Yoshiharu
分类号 H01L23/60;H01L33/62;H05K3/42;H01L23/12;H01L23/48;H05F3/00;H01L33/48;H05K1/02;H05K1/03;H05K1/11 主分类号 H01L23/60
代理机构 Studebaker & Brackett PC 代理人 Studebaker & Brackett PC
主权项 1. A mounting substrate comprising: a base material shaped like a flat plate having a first surface and a second surface opposed to the first surface; first and second component mounting conductors provided at a distance from each other on the first surface of the base material; first and second external connection conductors provided at a distance from each other on the second surface of the base material; a first wiring conductor disposed between the first surface of the base material and the first component mounting conductor, and shaped such as to be in contact with the first component mounting conductor and such as to avoid contact with the second component mounting conductor, a second wiring conductor disposed between the first surface and the second component mounting conductor, and shaped such as to be in contact with the second component mounting conductor and such as to avoid contact with the first component mounting conductor; an insulating layer disposed between the first and second wiring conductors and the first and second component mounting conductors such that center areas of the first and second wiring conductors are exposed therefrom; a first conductive hole open at one end between the first component mounting conductor and the second component mounting conductor on the first surface of the base material and being in contact at the other end with the first external connection electrode; and a second conductive hole open at one end between the first component mounting conductor and the second component mounting conductor on the first surface of the base material and being in contact at the other end with the second external connection electrode, wherein the first wiring conductor and the second wiring conductor partly project as projecting portions in a direction to approach each other, wherein the first conductive hole penetrates the projecting portion of the first wiring conductor, and wherein the second conductive hole penetrates the projecting portion of the second wiring conductor.
地址 Kyoto-fu JP