发明名称 Nonvolatile semiconductor memory device and method for driving same
摘要 According to one embodiment, a nonvolatile semiconductor memory device includes a substrate, a stacked body, a semiconductor pillar, a charge storage film, and a drive circuit. The stacked body is provided on the substrate. The stacked body includes a plurality of insulating films alternately stacked with a plurality of electrode films. A through-hole is made in the stacked body to align in a stacking direction. The semiconductor pillar is buried in an interior of the through-hole. The charge storage film is provided between the electrode film and the semiconductor pillar. The drive circuit supplies a potential to the electrode film. The diameter of the through-hole differs by a position in the stacking direction. The drive circuit supplies a potential to reduce a potential difference with the semiconductor pillar as a diameter of the through-hole piercing the electrode film decreases.
申请公布号 USRE45840(E1) 申请公布日期 2016.01.12
申请号 US201414327359 申请日期 2014.07.09
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 Katsumata Ryota;Aochi Hideaki;Tanaka Hiroyasu;Kito Masaru;Fukuzumi Yoshiaki;Kidoh Masaru;Komori Yosuke;Ishiduki Megumi;Matsunami Junya;Fujiwara Tomoko;Kirisawa Ryouhei;Mikajiri Yoshimasa;Oota Shigeto
分类号 G11C11/14;H01L27/115;G11C16/04;G11C16/06 主分类号 G11C11/14
代理机构 Oblon, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A nonvolatile semiconductor memory device, comprising: a substrate; a stacked body provided on the substrate, the stacked body including a plurality of insulating films alternately stacked with a plurality of electrode films, a through-hole being made in the stacked body to align in a stacking direction; a semiconductor pillar buried in an interior of the through-hole; a charge storage film provided between the electrode film and the semiconductor pillar; and a drive circuit supplying a potential to the electrode film, a diameter of the through-hole differing by a position in the stacking direction, the drive circuit supplying a potential to reduce a potential difference with the semiconductor pillar as a diameter of the through-hole piercing the electrode film decreases.
地址 Minato-ku JP