发明名称 |
Nonvolatile semiconductor memory device and method for driving same |
摘要 |
According to one embodiment, a nonvolatile semiconductor memory device includes a substrate, a stacked body, a semiconductor pillar, a charge storage film, and a drive circuit. The stacked body is provided on the substrate. The stacked body includes a plurality of insulating films alternately stacked with a plurality of electrode films. A through-hole is made in the stacked body to align in a stacking direction. The semiconductor pillar is buried in an interior of the through-hole. The charge storage film is provided between the electrode film and the semiconductor pillar. The drive circuit supplies a potential to the electrode film. The diameter of the through-hole differs by a position in the stacking direction. The drive circuit supplies a potential to reduce a potential difference with the semiconductor pillar as a diameter of the through-hole piercing the electrode film decreases. |
申请公布号 |
USRE45840(E1) |
申请公布日期 |
2016.01.12 |
申请号 |
US201414327359 |
申请日期 |
2014.07.09 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
Katsumata Ryota;Aochi Hideaki;Tanaka Hiroyasu;Kito Masaru;Fukuzumi Yoshiaki;Kidoh Masaru;Komori Yosuke;Ishiduki Megumi;Matsunami Junya;Fujiwara Tomoko;Kirisawa Ryouhei;Mikajiri Yoshimasa;Oota Shigeto |
分类号 |
G11C11/14;H01L27/115;G11C16/04;G11C16/06 |
主分类号 |
G11C11/14 |
代理机构 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
代理人 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
主权项 |
1. A nonvolatile semiconductor memory device, comprising:
a substrate; a stacked body provided on the substrate, the stacked body including a plurality of insulating films alternately stacked with a plurality of electrode films, a through-hole being made in the stacked body to align in a stacking direction; a semiconductor pillar buried in an interior of the through-hole; a charge storage film provided between the electrode film and the semiconductor pillar; and a drive circuit supplying a potential to the electrode film, a diameter of the through-hole differing by a position in the stacking direction, the drive circuit supplying a potential to reduce a potential difference with the semiconductor pillar as a diameter of the through-hole piercing the electrode film decreases. |
地址 |
Minato-ku JP |