发明名称 |
ELECTRONIC CIRCUIT DEVICE AND MANUFACTURING METHOD OF THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit device which enables heat radiation or cooling of a heating component while reducing a thickness of a circuit board on which the heating component is mounted, and to provide a manufacturing method of the electronic circuit board.SOLUTION: An electronic circuit device 10 according to the invention includes: a circuit board 20; a heating component 11 mounted on the circuit board 20; a metal plate 15 which forms a part of an inner layer of the circuit board 20 and protrudes from a side surface of the circuit board 20 to be exposed to the exterior; and a heat pipe 13 connected with an exposed portion of the metal plate 15. |
申请公布号 |
JP2016004810(A) |
申请公布日期 |
2016.01.12 |
申请号 |
JP20140122318 |
申请日期 |
2014.06.13 |
申请人 |
IBIDEN CO LTD |
发明人 |
ISHIHARA TERUYUKI;MORITA HARUHIKO;KARIYA TAKASHI |
分类号 |
H01L23/36;H01L23/12;H05K1/02;H05K7/20 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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