发明名称 ELECTRONIC CIRCUIT DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an electronic circuit device which enables heat radiation or cooling of a heating component while reducing a thickness of a circuit board on which the heating component is mounted, and to provide a manufacturing method of the electronic circuit board.SOLUTION: An electronic circuit device 10 according to the invention includes: a circuit board 20; a heating component 11 mounted on the circuit board 20; a metal plate 15 which forms a part of an inner layer of the circuit board 20 and protrudes from a side surface of the circuit board 20 to be exposed to the exterior; and a heat pipe 13 connected with an exposed portion of the metal plate 15.
申请公布号 JP2016004810(A) 申请公布日期 2016.01.12
申请号 JP20140122318 申请日期 2014.06.13
申请人 IBIDEN CO LTD 发明人 ISHIHARA TERUYUKI;MORITA HARUHIKO;KARIYA TAKASHI
分类号 H01L23/36;H01L23/12;H05K1/02;H05K7/20 主分类号 H01L23/36
代理机构 代理人
主权项
地址