发明名称 CHIP TYPE FUSE
摘要 PROBLEM TO BE SOLVED: To provide a chip type fuse that can operate stably even under a high-temperature, high-humidity environment, and that has an excellent weather resistance.SOLUTION: A chip type fuse comprises: an insulating substrate 11; a base glass layer 12 laminated on the insulating substrate; a pair of electrodes 13 and 13 arranged at both-end sides on the base glass layer; a fuse element 15 arranged between the electrodes; and an upper glass layer 17 that covers at least a fusing part of the element. The element 15 is configured by laminating a first metal layer 15a and a second metal layer 15b, and further comprises a barrier layer 16 that has a width wider than a width of the element 15 and that consists of a third metal layer covering the first and second metal layers. The third metal layer wraps and covers the first metal layer 15a via the second metal layer 15b. The first metal layer 15a is formed of Cr, and the second metal layer 15b is formed of Cu. The barrier layer 16 is formed of any one of Ta, Cr, Ni, NiCr, and Ti.
申请公布号 JP2016004736(A) 申请公布日期 2016.01.12
申请号 JP20140126036 申请日期 2014.06.19
申请人 KOA CORP 发明人 ISHIKAWA TAKAHIRO;ICHIKAWA HIROSHI;ITO CHIKA
分类号 H01H85/055;H01H85/02;H01H85/12 主分类号 H01H85/055
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