| 摘要 |
PROBLEM TO BE SOLVED: To provide power conversion equipment which can be downsized and can be improved in cooling capabilities of an electronic component at the same time.SOLUTION: Power conversion equipment 1 comprises: a semiconductor module 21 which constitutes a part of a first power conversion circuit; a cooler 3 through which a refrigerant circulates; and a case 4 for storing the semiconductor module 21 and the cooler 3. The cooler 3 includes: a cooler body part 31 for cooling the semiconductor module 21 with the refrigerant; a refrigerant introduction tube 32 for introducing a refrigerant from outside the case 4 to the cooler body part 31; and a refrigerant discharge tube 33 for discharging the refrigerant from the cooler body part 31 to outside the case 4, in which the refrigerant introduction tube 32 and the refrigerant discharge tube 33 project to outside the case 4 from the same direction, and in a space surrounded by the refrigerant introduction tube 32 and the refrigerant discharge tube 33 outside the case 4, an electronic component 5 which constitutes the power conversion equipment 1 is arranged. |
