发明名称 Photocoupler with protrusion
摘要 A photocoupler comprises an input side lead frame; an output side lead frame disposed facing the input side lead frame with a gap therebetween; a light emitting device mounted on a face of the input side lead frame facing the output side lead frame side; a light receiving device mounted on a face of the output side lead frame facing the input side lead frame side, opposite to and having a gap with the light emitting device; and a protrusion disposed on at least a part of an area around the light receiving device on the output side lead frame and being formed of conductive bonding wire or a bump, protruding to the input side lead frame side.
申请公布号 US9236954(B2) 申请公布日期 2016.01.12
申请号 US201314023027 申请日期 2013.09.10
申请人 Renesas Electronics Corporation 发明人 Mitamura Kazuhiro;Moribayashi Shigeru;Yaginuma Ryuta
分类号 G02B27/00;H04B10/80 主分类号 G02B27/00
代理机构 Foley & Lardner LLP 代理人 Foley & Lardner LLP
主权项 1. A photocoupler, comprising: an input side lead frame; an output side lead frame disposed facing the input side lead frame with a gap therebetween; a light emitting device mounted on a face of the input side lead frame facing the output side lead frame side; a first conductive bonding wire electrically connecting the input side lead frame to the light emitting device; a light receiving device mounted on a face of the output side lead frame facing the input side lead frame side, opposite to and having a gap with the light emitting device; a second conductive bonding wire electrically connecting the output side lead frame to the light receiving device; and a protrusion disposed on at least a part of an area around the light receiving device on the output side lead frame and being formed of a third conductive bonding wire or a bump, protruding to the input side lead frame side, wherein the protrusion has an apex that is sharp, wherein the protrusion is separate from the first conducting bonding wire and the second conductive bonding wire such that the protrusion does not connect the input side lead frame to the light emitting device or the output side lead frame to the light receiving device, wherein the protrusion is formed of a plurality of third conductive bonding wires.
地址 Kanagawa JP