WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a wiring board capable of being manufactured with a high yield and reducing costs, and including a metal plane layer.SOLUTION: A wiring board comprises: a wiring layer 24 including a wiring part A having a narrow wiring interval and a wiring part B having a wide wiring interval; an insulating layer 33 formed on the wiring layer 24; a metal plane layer PL formed on the insulating layer 33 on the wiring part A having the narrow wiring interval; an insulating layer 34 formed on the metal plane layer PL; a via hole VH3 reaching the wiring layer 24 from an upper surface of the insulating layer 34; a via conductor VC3 formed in the via hole VH3; a via hole VH4 formed on the insulating layer 34 and reaching the metal plane layer PL; a via conductor VC4 formed in the via hole VH4; a wiring layer 25 formed on the insulating layer 34 and connected to the wiring layer 24 via the via conductor VC3; and a wiring layer 26 formed on the insulating layer 34 and connected to the metal plane layer PL via the via conductor VC4.