POLISHING APPARATUS, POLISHING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To measure a condition of a polishing pad before polishing or during polishing.SOLUTION: A polishing apparatus comprises: a rotatable table on which a polishing pad having a polishing surface is provided; a polishing head which can cause a polishing object to contact the polishing surface in a state of holding the polishing object; a contact part capable of contacting the polishing surface during rotation of the table; and a measurement part for measuring a condition of a surface of the contact part, which contacts the polishing surface. A polishing method and a semiconductor device manufacturing method comprise: a measurement process of causing a contact part to contact a polishing surface of a polishing pad to measure a condition of the contact part; a determination process of determining a condition of a polishing pad based on the measurement result in the measurement process; and a polishing process performed based on the determination result in the determination process, of polishing a polishing object by causing the polishing object to contact the polishing surface.