| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device that can downsize a clean chamber.SOLUTION: A clean chamber 11 used for a semiconductor manufacturing device 1 comprises: an interface chamber 11A in which second transfer means 24 for transferring a work-piece to processing means 23, and delivery means 25 are arranged; a processing chamber 11B communicated with a rear part of the interface chamber 11A and in which the processing means 23 is arranged; a return duct 11C that is partitioned from the processing chamber 11B by a partition wall 30, and that is communicated with a lower part of the processing chamber 11B via a pair of left/right vertically long slits 31 and a pair of left/right laterally long slits 38 provided at a lower part of the partition wall 30, and that is utilized for returning air installed from the slits 31 and 38 back from above the processing chamber 11B; and a blow duct 11D that extends upward from the processing chamber 11B, and that is communicated with an upper part of the return duct 11C at its upper part. |
