| 摘要 |
PROBLEM TO BE SOLVED: To provide a sintering method of copper paste which improves sinterability of copper particles to form copper wiring reduced in conductivity.SOLUTION: A sintering method of copper paste includes an application step of applying a copper paste onto a substrate, a first heating step of heating the substrate in a nitrogen gas atmosphere containing an oxidizing gas in a vol. ratio of 500-2,000 ppm, after the application step, to oxidize and sinter copper particles in the copper paste and a second heating step of heating the substrate in a nitrogen gas atmosphere containing a reducing gas in a vol. ratio of 1% or more, after the first heating step, to reduce the oxidized-and-sintered copper oxide. |
